As a follow-up to its recent announcement of next-generation desktop chipset products targeted to hit the market in 2007, Silicon Integrated Systems (SiS) stated that the SiS665, the company's first northbridge that will support DDR3 memory technology, will reach production phase in the end of 2007, but volume shipments are currently not expected to start before 2008. The company also indicated that two other northbridges, the SiS672 (for the Intel platform) and SiS772 (for the AMD platform), will be the first SiS products manufactured under a 80nm CMOS process. Samples will presumably be available from early in the second quarter of 2007, and mass production is aimed to commence later in that quarter.
First samples of the SiS665 are expected to be ready in the third quarter of 2007, and this product will likely be another step in the 80nm process deployment by United Microelectronics Corporation (UMC). The northbridge will support both DDR2 and DDR3 memory interfaces, and this will probably be implemented through two memory controllers in the northbridge, SiS said. In addition to this, the chip will also support a next-generation PCIe interface, according to the company.
Later this year, as previously reported, SiS will introduce the SiS671 and SiS771 northbridge chips (for the respective Intel and AMD platforms), with customer samples expected to be available in August and mass production scheduled for October. As a complement to these northbridges, the company plans to release a new southbridge, the SiS968, which will be its first to support Serial ATA II and will be pin-to-pin compatible with its current SiS966. The new southbridge will be produced utilizing a 0.15-micron technology process, and the SiS671 and SiS771 will be both manufactured under a 0.11-micron process, SiS said.
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